Termékek csomagküldési szolgáltatások (5)

We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched

AMETEK EMC can provide packaging solutions for every need, with capabilities for applications such as: sealed pouches, anti-static bags, custom boxes, multi-material packaging, shock and vibration sensitive packaging, target component protection, and packaging for sterilization.

100% Biodegradable Snapfit Lids Interlocking Stacking Freezersafe Engineered to maintain food quality Packaging Type:Food Packaging / Delivery Usage/Application:Food Packaging / Delivery Material:Molded Fiber Color:Natural Unbleached Feature:Anti Leak, Compostable, Snap Fit, Stackable Minimum Order Quantity:1

Our High Purity Iron is generally used as a header material for Hermetic Package applications. The material is characterized by the extremely low carbon content (below 100ppm). Additional applications are as a catalyst for synthetic diamond production.

Rodar® is an Iron-Nickel-Cobalt alloy with an unique linear thermal expansion coefficient. It is also stable to cryogenic temperatures. This combination of characteristics has prompted its application in electrical package sealing of glass/metal and ceramic/metal. Rodar® can be formed and deep drawn from the annealed temper. A 1/8 hard temper is optimum for heavy piercing.The material can be joined to other metals by welding, brazing, and soldering. The joint design must consider that Rodar® has a lower expansion coefficient than most other metals. Available Sizes: Rodar® is available from Hamilton Precision Metals as strip product in thicknesses from 0.001” to 0.060” (0.0254 mm to 1.524 mm) and width up to 12.0” (304.8 mm). The material conforms to ASTM F15, AMS 7728 and UNS K94610. Density:0.302 lbs/cu.in. Melting Point (Approx.):1455°C Electrical Resistivity @ R.T.:49 Microhm·cm Thermal Expansion Coefficient (30° to 400°C):4.9 x 10-6/°C Thermal Conductivity @ 100°C:16.7 W/m·K Curie Temperature:435°C